BOND

BOND has taken part in 5 fintech rounds recorded since 9 November 2022, 2 of them as lead.

Added · 23 September 2026

News coverage

Asaas raises R$300M (about $55.6M) in its largest FIDC to date to finance receivables advances for Brazilian SMEs
7 October 2026
Asaas has completed a R$300 million issuance of FIDC Asaas III, a receivables fund dedicated to financing advances on its clients' credit card sales.

Company	Stage	Amount	Date	Investors
Asaas Added · 21 September 2026 · Weekly update #50	Series C	820,000,000 BRL	8 October 2024	BONDLead
Yassir Added · 7 October 2026 · fintech.global	Series B	150,000,000 USD	9 November 2022	BONDLead

Asaas
Series C8 October 2024
820,000,000 BRL
BONDLead
Added · 21 September 2026 · Weekly update #50
Yassir
Series B9 November 2022
150,000,000 USD
BONDLead
Added · 7 October 2026 · fintech.global

Company	Stage	Amount	Date	Investors
Kalshi Added · 21 September 2026 · Weekly update #87	Series C	185,000,000 USD	25 June 2025	BOND
Persona Added · 21 September 2026 · Weekly update #79	Series D	200,000,000 USD	2 May 2025	BOND
Asaas Added · 21 September 2026 · Weekly update #50	Series C	820,000,000 BRL	8 October 2024	BONDLead
Nium Added · 21 September 2026 · Weekly update #32	Series E	50,000,000 USD	4 June 2024	BOND
Yassir Added · 7 October 2026 · fintech.global	Series B	150,000,000 USD	9 November 2022	BONDLead

Kalshi
Series C25 June 2025
185,000,000 USD
BOND
Added · 21 September 2026 · Weekly update #87
Persona
Series D2 May 2025
200,000,000 USD
BOND
Added · 21 September 2026 · Weekly update #79
Asaas
Series C8 October 2024
820,000,000 BRL
BONDLead
Added · 21 September 2026 · Weekly update #50
Nium
Series E4 June 2024
50,000,000 USD
BOND
Added · 21 September 2026 · Weekly update #32
Yassir
Series B9 November 2022
150,000,000 USD
BONDLead
Added · 7 October 2026 · fintech.global